How to Build an Intelligent Computing Center in the AI Era? Vertiv™'s End-to-End AI Computing Solution Makes Computing Power Accessible

As AI large models rise, the demand for computing power is increasing rapidly, making intelligent computing centers more critical. Vertiv™ 360AI addresses the core needs of computing infrastructure, offering the preferred solution for intelligent computing center construction.

 

In the AI era, computing power is ubiquitous. Every time AI completes facial recognition or converts speech to text, it requires hardware chip support. When you make a payment on an e-commerce platform, billions of calculations are completed in the background in a split second. As the level of autonomous driving increases, computing power needs to grow exponentially, with L5-level requirements exceeding 2000TOPS.

According to a report released by IDC, by 2027, China's intelligent computing power scale is expected to exceed 1117EFLOPS (executing 10^18 floating-point operations per second).

AI is rapidly disrupting industries, and with the enormous demand for computing power, how can intelligent computing centers keep up?

At the "2024 International Computing Power Standards and Applications Symposium" hosted by the China Academy of Information and Communications Technology (CAICT), Vertiv™'s data center solutions expert, Wang Anlin, analyzed the challenges faced by intelligent computing centers and the core needs of computing infrastructure. He also shared Vertiv™'s 360AI end-to-end AI computing solution.

The event also revealed the award results, with Vertiv™'s Vertiv™ Liebert® APM2 modular UPS receiving the "ISCT'24 Annual Innovation Award."

Vertiv™360AI Addresses High-Density Trends

With the continuous increase in power density, high-density computing has become the biggest challenge and pain point for intelligent computing centers. In response to this trend, "high-density power supply and cooling, efficient energy supply, smaller footprint, and flexible rapid deployment" have become the core demands for computing infrastructure.

Vertiv™ has launched the Vertiv™ 360AI end-to-end AI computing solution, which provides an effective pathway to address these challenges and meet the ever-growing demand for computing power.

Four Key Advantages to Overcome Pain Points

Vertiv™ 360AI seamlessly integrates power management, thermal management, software, end-to-end lifecycle consulting, and professional services. With its four core advantages—"complete power management chain, comprehensive thermal management chain, integrated engineering management, and extensive source cooperation experience"—it effectively meets the core demands of computing infrastructure. From grid-to-chip power supply to outdoor heat dissipation from chips, Vertiv™ 360AI provides end-to-end support for building intelligent computing centers.

• Flexible and Resilient Power System Construction: Vertiv™ 360AI integrates prefabricated power modules, intelligent medium-power busbars, and other innovative products to meet the full power switching, distribution, and end-stage power distribution needs of facilities/outdoor spaces, rooms/rows, and cabinets/servers.
• Comprehensive Thermal Management Solutions: Vertiv™ 360AI offers a wide range of cooling solutions, including high-density air cooling and air-liquid hybrid cooling systems, to meet different power density cooling needs. The solution also maximizes energy savings by combining "pre-cooling + supplementary cooling" using natural cooling.
• Comprehensive Prefabricated Integrated Products: Vertiv™ 360AI reduces deployment time by up to 50% through prefabrication and pre-design based on computing power requirements, improving deployment efficiency and adapting to different site conditions.
• Global Collaboration for Innovation: Vertiv™ works with top-tier computing power partners globally, accumulating rich practical experience for research and development. Vertiv™ already has advanced practices in AIDC worldwide.

Classic Case of 1.26MW Intelligent Computing Infrastructure

Vertiv™ provided a "hybrid cooling" solution that satisfies the cooling needs of 70kW liquid-cooled cabinets and 30kW air-cooled cabinets.

Supporting the Construction of WanKaWanP and GB200 Clusters

Vertiv™ provided Vertiv™ Liebert® XDU cold plate liquid cooling on the liquid cooling side and Vertiv™ Liebert® AHU chilled water air walls on the air cooling side, effectively meeting the cooling demands.

As AI large models rise, the demand for computing power increases exponentially, and the role of intelligent computing centers becomes even more critical. Vertiv™ 360AI focuses on the core needs of computing infrastructure, providing the preferred solution for intelligent computing center construction.

With the rise of AI large models, the demand for computing power is growing rapidly, making the role of intelligent computing centers increasingly critical. Vertiv™ 360AI focuses on the core needs of computing infrastructure, providing the preferred solution for building intelligent computing centers.